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Intel’s 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables

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acastro_180529_1777_intel_0001.0.0.jpg Illustration by Alex Castro / The Verge

Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intel’s best answer yet to ARM.

The new “Intel Core processors with Intel Hybrid Technology” (an official name that almost guarantees that people will continue to refer to them as Lakefield chips) debuts two major technologies on its chipsets for the first time: hybrid cores and a more compact stacked Foveros 3D design.

The new chips are designed to power smaller, ultralight devices, the first three of which have already been announced: the Intel version of the Galaxy Book S...

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